Company Filing History:

27 out of 51,873

General Electric Company

patents

1 out of 490

Martin Marietta Corporation

Years Active: 1976-1995

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29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5418002 - Direct bonding of copper to aluminum nitride substrates (1995-05-23),

2. 5366906 - Wafer level integration and testing (1994-11-22),

3. 5304847 - Direct thermocompression bonding for thin electronic power chips (1994-04-19),

4. 5293070 - Integrated heat sink having a sinuous fluid channel for the thermal (1994-03-08),

5. 5291066 - Moisture-proof electrical circuit high density interconnect module and (1994-03-01),

6. 5209390 - Hermetic package and packaged semiconductor chip having closely spaced (1993-05-11),

7. 5206186 - Method for forming semiconductor electrical contacts using metal foil (1993-04-27),

8. 5184206 - Direct thermocompression bonding for thin electronic power chips (1993-02-02),

9. 5166773 - Hermetic package and packaged semiconductor chip having closely spaced (1992-11-24),

10. 5139972 - Batch assembly of high density hermetic packages for power semiconductor (1992-08-18),

11. 5135890 - Method of forming a hermetic package having a lead extending through an (1992-08-04),

12. 5105536 - Method of packaging a semiconductor chip in a low inductance package (1992-04-21),

13. 5103290 - Hermetic package having a lead extending through an aperture in the (1992-04-07),

14. 5100740 - Direct bonded symmetric-metallic-laminate/substrate structures (1992-03-31),

15. 5043859 - Half bridge device package, packaged devices and circuits (1991-08-27),

Title: Constantine A Neugebauer: Pioneering Innovator in Advanced Materials Integration

Introduction:

Constantine A Neugebauer, a distinguished inventor based in Schenectady, NY with an impressive portfolio of 29 patents, is renowned for his groundbreaking work in advanced materials integration. His innovative solutions have revolutionized the industry, particularly in the realm of thermal management and wafer-scale integration.

Latest Patents:

1. Direct bonding of copper to aluminum nitride substrates: Neugebauer's revolutionary process involves the direct bonding of a copper film to an yttria-doped aluminum nitride substrate. This technique, characterized by preoxidation and eutectic bonding, results in high thermal conductivity, low permittivity, and exceptional mechanical strength.

2. Wafer level integration and testing: By implementing a temporary or permanent dielectric layer and a pattern of electrical conductors, Neugebauer's method enables efficient wafer-scale integration and testing. This approach allows for streamlined repair processes and optimal signal propagation across interconnected wafers.

Career Highlights:

With a notable tenure at General Electric Company and Martin Marietta Corporation, Neugebauer has played a pivotal role in shaping the landscape of materials science and semiconductor technology. His expertise in developing cutting-edge solutions has led to significant advancements in the field, earning him a reputation as a true trailblazer.

Collaborations:

During his career, Neugebauer has collaborated closely with esteemed colleagues such as Homer H Glascock, II, and James F Burgess. Together, they have synergized their talents to create innovative solutions that have had a profound impact on the industry.

Conclusion:

Constantine A Neugebauer's prolific career as an innovator and inventor has been marked by a relentless pursuit of excellence and a commitment to pushing the boundaries of materials integration. His contributions continue to inspire future generations of inventors, cementing his legacy as a true pioneer in the field of advanced materials engineering.

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