Collin D Chan is a prominent inventor based in Dublin, CA (US). He has made significant contributions to the field of electronic device housing, holding a total of 13 patents. His work focuses on creating innovative solutions that enhance the functionality and design of electronic devices.

Latest Patents

One of his latest patents is titled "Multi-part electronic device housing having contiguous filled surface." This invention discloses a housing for an electronic device that allows electromagnetic waves to pass through. The design includes a first portion with an opening, a second portion positioned within that opening, and an insert with a protrusion that extends into a gap formed between the two portions. Additionally, the housing features a first ink layer surrounding the protrusion and a second ink layer over the first. The collaboration of these components results in a contiguous surface, with the second ink layer positioned approximately 5 microns or less below the exposed surfaces of both portions.

Career Highlights

Collin D Chan has established a successful career at Apple Inc., where he continues to innovate and develop new technologies. His expertise in electronic device design has made him a valuable asset to the company.

Collaborations

Throughout his career, Collin has worked alongside talented individuals such as Lindsay D Corbet and Ming Kun Shi. Their collaborative efforts have contributed to the advancement of technology in the electronic device sector.

Conclusion

Collin D Chan's innovative work in electronic device housing exemplifies the impact of creativity and engineering in technology. His contributions continue to shape the future of electronic devices, making them more efficient and effective.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com