Colin Bryant Stevens

Title: Colin Bryant Stevens: Innovator in Semiconductor Technology

Introduction

Colin Bryant Stevens is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative work has advanced the development of device packaging and bonding methods in the semiconductor industry.

Latest Patents

Colin's latest patents include a "Stress Isolated Device Package and Method of Manufacture." This invention describes a device package that features a die with a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface, and a trench extends entirely through the substrate, partially surrounding the sensor region. An isolation material may extend across the trench, and a ring structure is coupled to the first surface of the substrate, creating a cavity for the sensor. Additionally, he has developed a method for "Forming a Eutectic Bond Between a Wafer Having an Anti-Stiction Coating and a Cap Wafer." This patent details a process for bonding a cap wafer to a device wafer using a metal polysilicon germanium material, forming a sealed chamber around a semiconductor device.

Career Highlights

Colin has worked with prominent companies in the semiconductor industry, including NXP USA, Inc. and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.

Collaborations

Colin has collaborated with talented individuals such as Chad S. Dawson and Ruben B. Montez. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Colin Bryant Stevens is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the field. His contributions continue to influence the industry and inspire future innovations.