The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Jun. 16, 2016
Applicant:

Freescale Semiconductor Inc., Austin, TX (US);

Inventors:

Dubravka Bilic, Scottsdale, AZ (US);

Andrew C. McNeil, Chandler, AZ (US);

Lianjun Liu, Chandler, AZ (US);

Margaret Kniffin, Chandler, AZ (US);

Chad Dawson, Queen Creek, AZ (US);

Colin Stevens, Austin, TX (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); B81B 7/00 (2006.01); H01L 23/528 (2006.01); H01L 29/06 (2006.01); H01L 27/088 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); B81C 1/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); B81C 1/00333 (2013.01); H01L 21/768 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/552 (2013.01); H01L 24/05 (2013.01); H01L 27/088 (2013.01); H01L 29/0684 (2013.01); B81B 2207/07 (2013.01);
Abstract

A structure for preventing charge induced leakage of a semiconductor device includes a shield separated from a first interconnect by at least a first lateral spacing and separated from a second interconnect by at least a second lateral spacing. The first interconnect is connected to a first junction and the second interconnect is connected to a second junction. A shield bias is connected to the shield to terminate an electromagnetic field on the shield. The shield between the first and second lateral spacings has a minimum width to substantially prevent formation of a conductive channel between the first and second junctions. The shield may be formed over a portion of the first junction and over a portion of the second junction to substantially prevent formation of another conductive channel between the first and second junctions at a location that does not have the first and second lateral spacings.


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