Singapore, Singapore

Clinton Goh

USPTO Granted Patents = 4 

Average Co-Inventor Count = 6.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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4 patents (USPTO):

Title: Innovations of Clinton Goh in Semiconductor Technology

Introduction

Clinton Goh is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. With a total of 4 patents, he has made significant advancements in methods and apparatus for cleaving semiconductor substrates. His work is pivotal in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Clinton Goh's latest patents focus on innovative methods and apparatus for cleaving semiconductor substrates. These patents detail a process where the semiconductor chamber pressure is adjusted to a specific process pressure. A substrate is heated to a nucleation temperature of ions implanted in the substrate, followed by a temperature adjustment below the nucleation temperature. This temperature is maintained until the cleaving of the substrate occurs. The use of microwaves for heating the substrate is also highlighted in his patents. Additionally, a cleaving sensor is employed to detect successful cleaving by monitoring pressure changes, acoustic emissions, changes within the substrate, and residual gases released by the implanted ions during the cleaving process.

Career Highlights

Clinton Goh is currently associated with Applied Materials, Inc., a leading company in the semiconductor industry. His work at Applied Materials has allowed him to push the boundaries of semiconductor technology and contribute to the development of innovative solutions.

Collaborations

Clinton has collaborated with esteemed colleagues such as Yueh Sheng Ow and Yuichi Wada. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in semiconductor technology.

Conclusion

Clinton Goh's innovative work in semiconductor technology, particularly in the cleaving of substrates, showcases his expertise and commitment to advancing the field. His contributions are essential for the ongoing evolution of semiconductor manufacturing processes.

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