Company Filing History:
Years Active: 2008-2018
Title: The Innovations of Cliff C Lee
Introduction
Cliff C Lee is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 3 patents. His work focuses on developing advanced microelectronic substrates that enhance the functionality of various devices.
Latest Patents
One of Cliff C Lee's latest patents is titled "Microelectronic substrate for alternate package functionality." This patent describes microelectronic substrates, such as interposers and motherboards, that are designed with overlapping connection zones. This innovative design allows different microelectronic devices, including microprocessors, chipsets, and memory devices, to be alternately attached to the substrates, forming functional microelectronic packages. This advancement has the potential to improve the versatility and efficiency of electronic devices.
Career Highlights
Cliff C Lee is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work at Intel has positioned him as a key player in the development of next-generation electronic solutions.
Collaborations
Cliff has collaborated with notable colleagues, including Md Altaf Hossain and David W Browning. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Cliff C Lee's contributions to microelectronics through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative designs are paving the way for more advanced and functional electronic devices.