Intel Corporation

Cliff C Lee

David W Browning

Md Altaf Hossain

Brian P Kelly

Itai M Pines

Jen-Tai Hsu

Jeffrey Krieger

Fei Deng

Scott T Gardiner

The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Microelectronic substrate for alternate package functionality

A microelectronic circuit structure containing interleaved copies of a first circuit pattern and a second circuit pattern, each circuit pattern containing a transmitter and a receiver, where transmitters and receivers of the two circuit patterns are positioned so that the two transmitters are adjacent or so that the two receivers are adjacent. Other structures and methods are also described and claimed.

Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces

Growing community of inventors

Portland, OR, United States of America

Cliff C Lee