Clayton Lee Stevenson is a notable inventor based in Keller, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work primarily focuses on methods that enhance the efficiency and effectiveness of semiconductor packaging.

Latest Patents

One of his latest patents is titled "Singulation of Wafer Level Packaging." This method involves several steps before attaching a window assembly to a semiconductor wafer, which contains multiple integrated circuits. Each integrated circuit includes an electrical connection pad. The process begins with adhering the window assembly to a carrier fixture. Before the window assembly is attached to the semiconductor wafer, portions of the window assembly are removed to create removal areas. The window assembly is then attached to the semiconductor wafer, ensuring that the electrical connection pad of each integrated circuit is positioned within a removal area. Finally, the carrier fixture is removed, leaving the window assembly adhered to the semiconductor wafer with the electrical connection pads exposed.

Career Highlights

Clayton Lee Stevenson is currently employed at Texas Instruments Corporation, a leading company in semiconductor design and manufacturing. His innovative work has contributed to the advancement of technologies that are essential in various electronic devices.

Collaborations

Throughout his career, Clayton has collaborated with talented individuals such as Jason C Green and Daryl Ross Koehl. These partnerships have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies.

Conclusion

Clayton Lee Stevenson exemplifies the spirit of innovation in the semiconductor industry. His contributions through patents and collaborations continue to shape the future of technology.

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