Texas Instruments Corporation

Clayton Lee Stevenson

Buu Quoc Diep

Daryl Ross Koehl

Jason C Green

Brett A Mangrum

Frank Odell Armstrong

John P Ossenfort

A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.

Singulation of wafer level packaging

A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Semiconductor device structures and their fabrication

Mems device and fabrication method

MEMS device and fabrication method

An apparatus for use with a digital micro-mirrorincludes a hingedisposed outwardly from a substrate. The hingeis capable of at least partially supporting a micro-mirrordisposed outwardly from the hinge. The micro-mirroris capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hingecomprises a substantially flat profile for at least a portion of the hingedisposed between a first hinge postof the hingeand a mid-point of the hinge. The apparatus also includes a plurality of process control voids formed within a conductive layerdisposed inwardly from the hinge. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Hinge design for enhanced optical performance for a digital micro-mirror device

An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate. The hinge is capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror is capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hinge comprises a substantially flat profile for at least a portion of the hinge disposed between a first hinge post of the hinge and a mid-point of the hinge. The apparatus also includes a plurality of process control voids formed within a conductive layer disposed inwardly from the hinge. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Growing community of inventors

Keller, TX, United States of America

Clayton Lee Stevenson