The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Dec. 29, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Clayton Lee Stevenson, Fort Worth, TX (US);

Frank Odell Armstrong, Terrell, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); G02B 26/08 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
B81C 1/00896 (2013.01); B81C 1/00317 (2013.01); B81C 99/004 (2013.01); G02B 26/0833 (2013.01); B81C 2203/0118 (2013.01);
Abstract

A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.


Find Patent Forward Citations

Loading…