Chunlin C Xia

Title: Innovations of Chunlin C Xia

Introduction

Chunlin C Xia is an accomplished inventor based in Phoenix, AZ. He has made significant contributions to the field of sensor technology, holding two patents that showcase his innovative approach to fabrication methods.

Latest Patents

Chunlin C Xia's latest patents include "Methods for fabricating sensor device package using a sealing structure" and "Sensor device with sealing structure." The first patent provides fabrication methods for sensor device packages, involving the bonding of a sensor structure and another structure using a sealing structure. This sealing structure surrounds a diaphragm region of the sensor structure, ensuring an airtight seal that establishes a fixed reference pressure on one side of the diaphragm region. The second patent describes an apparatus and related fabrication methods for a sensor device, which includes a sensor structure with a sensing arrangement and a second structure. A sealing structure is interposed between these components, surrounding the first portion of the sensor structure and establishing a fixed reference pressure on one side while exposing the opposing side to ambient pressure.

Career Highlights

Chunlin C Xia is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative sensor technologies. His work has contributed to advancements in the field, enhancing the performance and reliability of sensor devices.

Collaborations

Chunlin has collaborated with notable colleagues, including Stephen Ryan Hooper and Dwight Lee Daniels, who have also contributed to the development of sensor technologies.

Conclusion

Chunlin C Xia's innovative patents and contributions to sensor technology highlight his expertise and commitment to advancing the field. His work at Freescale Semiconductor, Inc. continues to influence the development of reliable sensor devices.