Chung Lyul Ahn

Title: **Chung Lyul Ahn: Innovator in Integrated Circuit Packaging**

Introduction

Chung Lyul Ahn is a notable inventor based in Chunng-ju si, South Korea. His contributions to the field of integrated circuit packaging have advanced technology in significant ways. Ahn holds one patent that showcases his innovative prowess.

Latest Patents

Chung Lyul Ahn's single patent is an *Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof*. This invention comprises a substrate with a device attached on its top surface. A mold encapsulates the device and features a through via along with a recessed pattern, both created in a streamlined process. Additionally, it employs a conductive via in the through via and a conductive pattern in the recessed pattern, both formed through another single process. This patent reflects Ahn’s ingenuity in simplifying complex manufacturing processes.

Career Highlights

Ahn is associated with Stats Chippac Pte. Ltd., where he has made significant strides in advancing integrated circuit technologies. His expertise has positioned him as a valuable asset in the company, contributing to their cutting-edge innovations in packaging solutions.

Collaborations

Throughout his career, Chung Lyul Ahn has collaborated with talented individuals such as Woo Jin Kim and Sun Jae Kim. These collaborations foster an environment of creativity and shared knowledge, enhancing the development of innovative technologies within their field.

Conclusion

Chung Lyul Ahn has made a meaningful impact in the technology sector with his pioneering work in integrated circuit packaging. His patent not only highlights his innovative capabilities but also represents a critical advancement for manufacturing processes in the industry. With ongoing collaborations and his current role at Stats Chippac Pte. Ltd., Ahn is poised to continue making significant contributions to the field of electronics and beyond.