Chung-Ling Liou

Title: Inventor Chung-Ling Liou: Innovating Communication Interface Structures

Introduction

Chung-Ling Liou is a notable inventor based in Hsinchu, Taiwan, recognized for his contributions to the field of semiconductor technology. With a focus on enhancing communication interfaces within electronic components, Liou has successfully secured one patent that showcases his innovative insights.

Latest Patents

Liou’s recent patent, titled "Communication interface structure between processing die and memory die," introduces a sophisticated architecture for connecting multiple dies. This structure comprises a memory die and processing dies, interconnected through dedicated routing pathways. Notably, the memory die features a first interface edge that is divided into several interface groups, facilitating seamless communication with the second interface edges of the processing dies. This innovative design enhances the overall functionality and efficiency of semiconductor devices.

Career Highlights

Chung-Ling Liou has accumulated significant experience in the semiconductor industry, having worked with prominent companies such as Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company Ltd. His tenure at these organizations has allowed him to refine his technical skills and collaborate with diverse teams on groundbreaking projects.

Collaborations

Throughout his career, Liou has had the privilege of working alongside talented professionals in the field. Notable collaborators include Wei-Chieh Liao and Igor Elkanovich, both of whom have contributed their expertise to various projects, enriching the innovation landscape in semiconductor technology.

Conclusion

Chung-Ling Liou's inventive spirit and dedication to advancing communication interface structures have positioned him as a valuable figure in the semiconductor sector. His patent exemplifies the impact innovative thinkers can have on technology, as they work to create more efficient and effective electronic solutions.