This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Chung-Kuang Lin
Introduction
Chung-Kuang Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on innovative package structures and methods for fabrication.
Latest Patents
Chung-Kuang Lin holds a patent for a "Package structure and method for fabricating the same." This patent describes a package structure that includes at least one semiconductor die and a redistribution layer. The connectors are strategically placed between the semiconductor die and the redistribution layer, ensuring electrical connectivity. The redistribution layer features a dielectric layer with an opening and a metallic pattern layer, which includes a metallic via surrounded by a dielectric spacer.
Career Highlights
Chung-Kuang Lin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has contributed to advancements in semiconductor packaging technology.
Collaborations
Chung-Kuang Lin has collaborated with Hsiang-Wei Liu, enhancing the innovation process through teamwork and shared expertise.
Conclusion
Chung-Kuang Lin's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile