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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12543546 B1

PDFFull Text
Date of Patent:
Feb. 03, 2026

Filed:

Mar. 30, 2023

Package structure and method for fabricating the same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsiang-Wei Liu, Tainan, TW;

Chung-Kuang Lin, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Bac H Au

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/302 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76837 (2013.01); H01L 21/302 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 21/76224 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 23/5389 (2013.01);
Abstract

A package structure and a manufacturing method thereof are disclosed. The structure includes at least one semiconductor die, a redistribution layer disposed on the at least one semiconductor die, and connectors there-between. The connectors are disposed between the at least one semiconductor die and the redistribution layer, and electrically connect the at least one semiconductor die and the redistribution layer. The redistribution layer includes a dielectric layer with an opening and a metallic pattern layer disposed on the dielectric layer, and the metallic pattern layer includes a metallic via located inside the opening with a dielectric spacer surrounding the metallic via and located between the metallic via and the opening.

Find Patent Forward Citations

Liu, Hsiang-Wei. (2026). Package structure and method for fabricating the same (U.S. Patent No. 12543546). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12543546

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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