This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun-Yueh Yang and Semiconductor Packaging Innovation.
Introduction
Chun-Yueh Yang is an inventor associated with Taipei, Taiwan. His patent work concerns integrated circuit packaging, including interposer structures and redistribution layers.
Latest Patents
Yang is credited with 1 patent: “Integrated Circuit Packages and Methods of Forming the Same.” The invention describes an interposer with multiple redistribution layers, a dielectric layer surrounding a central redistribution layer, and a direct via connecting conductive features across layers. This arrangement provides a way to form electrical connections within an integrated circuit package.
Career Highlights
Yang is associated with Taiwan Semiconductor Manufacturing Co., Ltd. His patent reflects work in semiconductor packaging and interconnect design.
Collaborations
The supplied information lists Hsien-Wei Chen and Chieh-Lung Lai as Yang’s coworkers. Their shared company affiliation places their work within Taiwan’s semiconductor industry.
Conclusion
Chun-Yueh Yang’s documented invention focuses on interposer architecture and electrical connections in integrated circuit packages, contributing to advances in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile