This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: The Innovations of Chun-Yu Hsieh
Introduction
Chun-Yu Hsieh is an inventive mind based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging and integrated circuits. His work focuses on enhancing the efficiency and reliability of electronic components.
Latest Patent Applications
Chun-Yu Hsieh has filed several notable patent applications. One of his latest applications is for an "ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF." This invention involves an electronic package that includes an electronic element and a heat dissipation structure. The heat dissipation structure covers the electronic element and is designed to improve bonding areas, thereby preventing peeling issues. Another significant application is for a "VOLTAGE CONVERTING INTEGRATED CIRCUIT." This circuit comprises multiple switches and a control circuit that manages the operation of these switches based on a mode setting signal.
Conclusion
Chun-Yu Hsieh continues to innovate in the field of electronics, focusing on solutions that enhance the performance and durability of electronic devices. His latest patent applications reflect his commitment to advancing technology in meaningful ways.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile