This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Chun-Yang Su: Inventor in Chip Packaging
Introduction
Chun-Yang Su is an inventor based in Hsinchu, Taiwan. His patent work includes a chip-packaging design intended to protect a chip from pressure exerted by nearby components.
Latest Patents
Su is credited with 1 patent: “Chip Package Having a Flexible Substrate.” The design places a chip and a pressure-proof member on one surface of a flexible substrate, with a reinforcement sheet on the opposite surface. The pressure-proof member includes a pair of ribs positioned outside and on opposite sides of the chip. These ribs help shield the chip from pressure caused by other components, such as a curved panel.
Career Highlights
Su is associated with Chipbond Technology Corporation. His patented design addresses mechanical protection in chip packages that use flexible substrates.
Collaborations
Su’s listed coworkers include Nian-Cih Yang and Xin-Wei Lo.
Conclusion
Chun-Yang Su’s patent describes a flexible-substrate chip package with protective ribs and reinforcement, reflecting a practical approach to reducing pressure-related damage.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile