Chipbond Technology Corporation

Chun-Yang Su

Nian-Cih Yang

Xin-Wei Lo

Jhao-Shin Wang

A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.

Growing community of inventors

Hsinchu, Taiwan

Chun-Yang Su