Chun-Hung Lin

Title: Innovator Chun-Hung Lin: Crafting Advanced Packaging Solutions

Introduction

Chun-Hung Lin, an accomplished inventor based in Taichung Hsien, Taiwan, has made significant contributions to the field of semiconductor packaging technology. With a portfolio of two patents, he has focused on developing innovative solutions that enhance the functionality and reliability of micro-electro-mechanical systems (MEMS).

Latest Patents

Chun-Hung Lin's latest patents reflect his dedication to advancing packaging methodologies. The first patent details an "Interconnection Structure for Package and Fabrication Method Thereof," which introduces a substrate body with a conductive portion, a photosensitive dielectric layer, and a conductive via. This structure simplifies the fabrication process while reducing costs and time, thereby streamlining the production of electronic packages.

His second patent, "Package Structure Having Micro-Electro-Mechanical System Element and Method of Fabrication the Same," encompasses an innovative package design that integrates a substrate with a ground pad and an MEMS element. Featuring a lid to protect the MEMS component, accompanied by a wire segment and encapsulant, this design effectively grounds the system while improving reliability by releasing accumulated electric charges.

Career Highlights

Currently, Chun-Hung Lin is a key contributor at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work emphasizes the importance of innovation in developing effective solutions that meet the growing demands of the technology sector.

Collaborations

In his professional endeavors, Chun-Hung Lin collaborates with esteemed colleagues like Chun-Hung Lu and Guang-Hwa Ma. Together, they contribute to pioneering advancements in packaging technology, fostering an environment of innovation and excellence in their industry.

Conclusion

Chun-Hung Lin's work represents a significant step forward in semiconductor packaging technology. His patented inventions not only improve existing methodologies but also open avenues for future advancements. As the demand for reliable micro-electro-mechanical systems continues to grow, innovators like Chun-Hung Lin play a crucial role in shaping the industry's future.