Siliconware Precision Industries Co., Ltd.

Chun-Hung Lin

Hsin-Yi Liao

Hong-Da Chang

Chun-Hung Lu

Kuang-Hsin Chen

Guang-Hwa Ma

Cheng-Hsiang Liu

Hsiao-Chun Huang

Kuang-Wei Huang

An interconnection structure for a package is disclosed. The interconnection structure includes a substrate body having a conductive portion formed on a surface thereof; a first photosensitive dielectric layer formed on the surface of the substrate body and having a via for exposing the conductive potion; a conductive via formed in the via; a second photosensitive dielectric layer formed on the first photosensitive dielectric layer and having a opening for exposing the conductive via and a portion of the first photosensitive dielectric layer; and a conductive trace layer formed in the opening of the second photosensitive dielectric layer so as to be electrically connected to the conductive portion through the conductive via, thereby simplifying the fabrication process and reducing the fabrication cost and time.

Interconnection structure for package and fabrication method thereof

A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.

Package structure having micro-electro-mechanical system element and method of fabrication the same

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Taichung Hsien, Taiwan

Chun-Hung Lin