Taichung, Taiwan

Chun-Hung Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Hung Cheng. Retrieved from https://idiyas.com/inventor/chun-hung-cheng-1i2vuqbk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Chun-Hung Cheng

Introduction

Chun-Hung Cheng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronics, particularly in capacitor technology. His innovative approach has led to the development of a unique capacitor design that enhances performance and reliability.

Latest Patents

Cheng holds a patent for a "Capacitor and method for forming the same." This invention features cup-shaped lower electrodes positioned on a substrate, with a dielectric layer that covers both the inner and outer surfaces of these electrodes. Additionally, a support layer connects the electrodes, while an annealed oxide layer is strategically placed to improve the capacitor's functionality. This design not only optimizes the capacitor's performance but also provides a method for its formation.

Career Highlights

Chun-Hung Cheng is currently employed at Winbond Electronics Corporation, a leading company in the semiconductor industry. His work at Winbond has allowed him to focus on advancing capacitor technology, contributing to the company's reputation for innovation and quality.

Collaborations

Cheng has collaborated with talented coworkers such as Wei-Chao Chou and Yen-Min Juan. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chun-Hung Cheng's contributions to capacitor technology exemplify the spirit of innovation in the electronics field. His patent and work at Winbond Electronics Corporation highlight his commitment to advancing technology and improving electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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