The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Feb. 04, 2022
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Yu-Ping Hsiao, Taichung, TW;

Cheol-Soo Park, Taichung, TW;

Chun-Hung Cheng, Taichung, TW;

Wei-Chieh Chuang, Taichung, TW;

Wei-Chao Chou, Taichung, TW;

Yen-Min Juan, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01G 4/008 (2006.01); H01G 4/01 (2006.01);
U.S. Cl.
CPC ...
H10B 12/00 (2023.02); H01G 4/0085 (2013.01); H01G 4/01 (2013.01);
Abstract

A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.


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Hsiao, Yu-Ping. (2025). Capacitor and method for forming the same (U.S. Patent No. 12232309). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12232309

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