Singapore, Singapore

Chun Hoe Yik

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Chartered Semiconductor Manufacturing Ltd (Corporation), Globalfoundries Singapore Pte. Ltd.. Active years: 1996-2019.

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 1996-2019

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2 patents (USPTO):Explore Patents

Title: Innovations of Chun Hoe Yik

Introduction

Chun Hoe Yik is a notable inventor based in Singapore, recognized for his contributions to the field of microelectromechanical systems (MEMS) and semiconductor fabrication. With a total of two patents to his name, he has made significant advancements in technology that enhance the efficiency and effectiveness of electronic devices.

Latest Patents

Chun Hoe Yik's latest patents include "Wafer Level Packaging for MEMS Device" and "Contact Hole Mask for Semiconductor Fabrication." The first patent describes a MEMS device that features a device substrate with both top and bottom surfaces, encapsulated by eutectic bonds that enhance its durability. The second patent introduces an improved process latitude mask for forming contact or via hole openings in a photoresist masking layer, which optimizes the fabrication of semiconductor integrated circuits.

Career Highlights

Throughout his career, Chun Hoe Yik has worked with prominent companies such as Chartered Semiconductor Manufacturing Ltd and Globalfoundries Singapore Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the semiconductor industry.

Collaborations

Chun Hoe Yik has collaborated with talented individuals in his field, including Ron-Fu Chu and Siddharth Chakravarty. These partnerships have fostered a creative environment that encourages the development of innovative solutions.

Conclusion

Chun Hoe Yik's work exemplifies the spirit of innovation in the technology sector. His patents and collaborations reflect a commitment to advancing the fields of MEMS and semiconductor fabrication.

Profile summary based on public USPTO records.
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