Taipei, Taiwan

Chun-Hao Chen

This inventor holds 3 USPTO granted patents. Top assignee: Unimicron Technology Corporation. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Hao Chen. Retrieved from https://idiyas.com/inventor/chun-hao-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.2

ph-index = 1


Location History:

  • New Taipei, TW (2019 - 2020)
  • Taoyuan, TW (2023)

Company Filing History:


Years Active: 2019-2023

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3 patents (USPTO):Explore Patents

Title: Innovations of Chun-Hao Chen

Introduction

Chun-Hao Chen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced wiring boards and carrier structures. With a total of 3 patents to his name, his work continues to influence the industry.

Latest Patents

Chun-Hao Chen's latest patents include a wiring board and a method of manufacturing the same. This innovative wiring board consists of an insulating layer, a wiring layer, and a plurality of conductive columns. The insulating layer features a first surface and a second surface that is opposite to the first surface. The wiring layer is integrated within the insulating layer and has a third surface and a fourth surface that is opposite to the third surface. The insulating layer covers the third surface, ensuring that the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are strategically placed within the insulating layer and are connected to the wiring layer. These columns extend from the third surface of the wiring layer to the first surface of the insulating layer, protruding from the first surface. Another significant patent is for a carrier structure, which includes a substrate, a first patterned circuit layer, and at least one magnetic element. The substrate has a first surface and an opening that passes through it. The first patterned circuit layer is positioned on the first surface of the substrate and features an annular circuit designed to generate an electromagnetic field. The magnetic element is located within the opening of the substrate, coupling with the annular circuit and responding to the magnetic force of the electromagnetic field.

Career Highlights

Chun-Hao Chen is currently employed at Unimicron Technology Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic components.

Collaborations

Chun-Hao Chen collaborates with talented individuals such as Chang-Fu Chen and Yi-Lin Chiang, contributing to a dynamic and innovative work environment.

Conclusion

Chun-Hao Chen's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to pave the way for future innovations in electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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