The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Nov. 21, 2017
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Chang-Fu Chen, Taoyuan, TW;

Chun-Hao Chen, New Taipei, TW;

Kuan-Hsi Wu, Taoyuan, TW;

Pi-Te Pan, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01); H01F 5/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 17/0006 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01L 23/5227 (2013.01); H05K 1/111 (2013.01); H05K 1/165 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/0086 (2013.01); H01F 2027/2819 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09272 (2013.01);
Abstract

A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.


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