Chun-Chin Huang

Title: Innovations of Chun-Chin Huang in Semiconductor Technology

Introduction

Chun-Chin Huang is a notable inventor based in Kaohsiung, Taiwan, recognized for his contributions to semiconductor technology. With a total of two patents to his name, Huang has made significant advancements in the field, particularly in the design and manufacturing processes of semiconductor devices.

Latest Patents

Huang's latest patents include innovative designs for semiconductor chips and devices. One of his patents describes a semiconductor device that features a substrate main body, multiple first bump pads, and a redistribution layer (RDL). The first bump pads are strategically placed adjacent to the substrate's surface, each exhibiting a unique profile with varying widths. This design enhances the device's functionality and efficiency. Another patent focuses on a semiconductor device package ready for assembly, which includes a semiconductor substrate, an under-bump metallurgy (UBM) layer, and conductive pillars made from different materials, one of which contains an antioxidant. These innovations reflect Huang's commitment to improving semiconductor technology.

Career Highlights

Chun-Chin Huang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge semiconductor solutions. His work has positioned him as a key player in the semiconductor industry, contributing to advancements that benefit various applications.

Collaborations

Huang collaborates with esteemed colleagues such as Yung I Yeh and Che-Ming Hsu, further enhancing the innovative environment at Advanced Semiconductor Engineering, Inc. Their combined expertise fosters a culture of creativity and technological advancement.

Conclusion

Chun-Chin Huang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to pave the way for future innovations in semiconductor devices.