The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Mar. 01, 2016
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chun-Jun Zhuang, Kaohsiung, TW;

Hung-Chun Kuo, Kaohsiung, TW;

Chun-Chin Huang, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 24/03 (2013.01); H01L 24/14 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/14051 (2013.01);
Abstract

A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.


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