This inventor holds 1 USPTO granted patent and 8 published patent applications. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun-chieh Liao: Inventor of a Power Component Submount
Introduction
Chun-chieh Liao is an inventor associated with Taoyuan, Taiwan, and Tong Hsing Electronic Industries, Ltd. His patent work focuses on a submount designed to support the mounting of a power component. The available information lists 1 patent for him.
Latest Patents
Liao’s listed patent is “Power Component Submount and Manufacturing Method Thereof.” It describes a ceramic substrate with a sputtering layer and a conductive block formed on an electroplating portion of that layer. Three electroless plating layers are stacked on the conductive block, using either gold, palladium, and gold, or nickel, palladium, and gold. The outermost plating layer provides a surface for mounting a power component.
Career Highlights
Liao’s patent reflects work on the structure and manufacture of submounts for power components. The design combines a ceramic substrate with conductive and plated layers, specifying alternative material combinations for the electroless plating.
Collaborations
The listed coworkers associated with Liao are Jia-Zheng Xu and Jian-yu Shih. The patent is connected with Tong Hsing Electronic Industries, Ltd.
Conclusion
Chun-chieh Liao’s listed invention concerns a layered ceramic submount that provides a plated mounting surface for a power component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile