Chuan-Cheng Tsou

Title: Chuan-Cheng Tsou and Semiconductor Packaging Innovation.

Introduction

Chuan-Cheng Tsou is an inventor associated with Tainan, Taiwan. His patent work concerns semiconductor packaging, including techniques intended to improve bonding and device performance. He is associated with Taiwan Semiconductor Manufacturing Company Limited.

Latest Patents

Tsou is credited with 1 patent: “Methods for Forming a Back Side Film Stack and Package Structures Thereof.” The patent describes forming a film stack during fabrication or bonding. The stack is designed to reduce wet-dip attack on semiconductor substrates during bonding, including bonding between image-sensor and logic-device substrates.

The disclosed approach may also help modulate stress and wafer warpage, supporting improved bonding adhesion and device performance. The patent describes potential use in packaging schemes such as CoWoS and SoIC, as well as wafer-to-wafer and die-to-die bonding.

Career Highlights

The available information connects Tsou’s patent activity with semiconductor packaging research and development at Taiwan Semiconductor Manufacturing Company Limited. His disclosed invention addresses challenges in bonding processes and package structures.

Collaborations

The patent’s subject matter involves bonding semiconductor substrates and devices, including image-sensor and logic-device substrates. The provided information does not identify specific collaborators or co-inventors.

Conclusion

Chuan-Cheng Tsou’s patent focuses on a back-side film stack intended to manage substrate protection, stress, and warpage during semiconductor bonding. It reflects an effort to improve packaging processes and device performance across multiple bonding approaches.