Chu-Chi Hsu

Title: Innovations of Chu-Chi Hsu in Semiconductor Technology

Introduction

Chu-Chi Hsu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on improving semiconductor packaging methods, which are crucial for the advancement of electronic devices.

Latest Patents

One of his latest patents is titled "Semiconductor package and fabrication method thereof." This invention provides a semiconductor package that includes a first semiconductor device with conductive balls on its top surface and a second semiconductor device with conductive posts on its bottom surface. The conductive posts are bonded to the conductive balls, allowing for efficient electrical connections. This design enables better control over the height of the semiconductor package, making it suitable for fine-pitch conductive balls.

Another significant patent is the "Package on package structure and fabrication method thereof." This invention describes a package on package (PoP) structure that features a packaging substrate with conductive bumps and an electronic element stacked on it. The conductive posts of the electronic element bond to the conductive bumps, facilitating the stacking process. This innovation enhances the efficiency of the assembly process in semiconductor packaging.

Career Highlights

Chu-Chi Hsu is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative ideas in semiconductor packaging. His contributions have been instrumental in advancing the technology used in modern electronics.

Collaborations

Some of his notable coworkers include Lung-Yuan Wang and Cheng-Chia Chiang. Their collaboration has likely contributed to the successful development of innovative semiconductor solutions.

Conclusion

Chu-Chi Hsu's inventions in semiconductor packaging demonstrate his commitment to advancing technology in the electronics industry. His patents reflect a deep understanding of the complexities involved in semiconductor design and fabrication. His work continues to influence the future of electronic device manufacturing.