This inventor holds 2 USPTO granted patents. Top assignees: International Business Machines Corporation, Stmicroelectronics Gmbh. Active years: 2013-2017.
Location History:
- Armenia, NY (US) (2013)
- Armeia, NY (US) (2017)
Company Filing History:


Years Active: 2013-2017
Title: Christopher B D'Aleo: Innovator in Defect Localization Technologies
Introduction
Christopher B D'Aleo is a notable inventor based in Armeia, NY (US). He has made significant contributions to the field of defect localization technologies, holding a total of 2 patents. His work focuses on enhancing the testing processes for semiconductor manufacturing.
Latest Patents
D'Aleo's latest patents include innovative methods for creating via chains and serpentine/comb test structures in the kerf areas of a wafer. The first patent describes a via chain test structure that consists of a first and second via chain in a kerf area, where geometrically shaped portions of both chains alternate along the length of the area. The second patent outlines a method for forming these test structures, emphasizing the use of low and high magnification testing to identify defective geometrically shaped portions that contain defective via structures.
Career Highlights
Throughout his career, Christopher B D'Aleo has worked with prominent companies in the technology sector, including STMicroelectronics GmbH and International Business Machines Corporation (IBM). His experience in these organizations has allowed him to refine his expertise in semiconductor technologies and defect localization.
Collaborations
D'Aleo has collaborated with several professionals in his field, including Balasingham Bahierathan and Shenzhi Yang. These collaborations have contributed to the advancement of his research and innovations.
Conclusion
Christopher B D'Aleo is a distinguished inventor whose work in defect localization technologies has made a significant impact in the semiconductor industry. His patents and career achievements reflect his dedication to innovation and excellence in his field.