Dresden, Germany

Christian Goetze


Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2023

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: Christian Goetze: Innovator in Chip Module and Wafer Level Packaging Technologies

Introduction

Christian Goetze is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, particularly in chip module structures and wafer level packaging. With a total of two patents to his name, Goetze's work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

Goetze's latest patents include innovative designs for chip modules with robust in-package interconnects. These structures are engineered to ensure reliable performance through various methods, such as utilizing vias in a spiral step pattern within the interconnect. Additionally, some designs incorporate an interconnect stabilizer, which features a repeating step pattern of vias encircling the interconnect, providing electrical isolation from solder balls and chip connections. His second patent involves wafer level packaging with integrated antenna structures, allowing for very short electrical connections between antenna structures and semiconductor chips. This design promotes a space-efficient configuration, enhancing the overall performance of RF semiconductor chips.

Career Highlights

Christian Goetze has worked with prominent companies in the semiconductor industry, including GlobalFoundries Inc. and GlobalFoundries U.S. Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in chip technology.

Collaborations

Throughout his career, Goetze has collaborated with talented professionals such as Marcel Wieland and Saquib B Halim. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Christian Goetze is a distinguished inventor whose work in chip module structures and wafer level packaging has made a significant impact on the semiconductor industry. His innovative patents reflect his commitment to enhancing electronic component reliability and efficiency.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…