The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Aug. 31, 2018
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Marcel Wieland, Radebeul, DE;
Christian Goetze, Dresden, DE;
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/498 (2013.01); H01L 24/09 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01);
Abstract
RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.