Chow York Lee

Title: Chow York Lee and Semiconductor Package Testing Innovations.

Introduction

Chow York Lee is an inventor based in Singapore whose patent work focuses on semiconductor package testing. His inventions address capacitive measurement techniques designed to assess different zones of a semiconductor package. Lee is associated with Infineon Technologies AG and has 2 patents listed in the provided information.

Latest Patents

Lee’s listed patents include “Multi-channel probe plate for semiconductor package test systems.” The invention describes an electrically insulating probe plate with multiple conductive coupling regions, each positioned to correspond to a different zone of a semiconductor package. Separate circuitry channels measure parameters indicating the degree of capacitive coupling between each region and its corresponding package zone.

His other listed patent is “Capacitive test method, apparatus and system for semiconductor packages.” It describes a multi-channel probe plate and circuitry that measures capacitive coupling across package zones, generates a capacitance signal for each coupling region, and selects signals for analysis. Together, these inventions support zone-by-zone capacitive testing of semiconductor packages.

Career Highlights

Lee’s listed patent portfolio centers on semiconductor test apparatus and methods. The inventions use multiple sensing regions and channels to gather measurements from different areas of a package, enabling targeted analysis of capacitive coupling.

Collaborations

The provided information identifies Ming Xue as Lee’s coworker. It does not specify whether they collaborated on the listed patents.

Conclusion

Chow York Lee’s listed inventions apply multi-channel capacitive measurement to semiconductor package testing, with a focus on assessing distinct package zones.