Infineon Technologies Ag

Chow York Lee

Ming Xue

A test apparatus includes a multi-channel probe plate having an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface. Each of the electrically conductive coupling regions is configured to cover a different zone of a semiconductor package when the semiconductor package is positioned in close proximity to the first main surface of the plate. The test apparatus further includes circuitry electrically connected to each of the coupling regions of the probe plate via a different channel. The circuitry is operable to measure a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region.

Multi-channel probe plate for semiconductor package test systems

A multi-channel probe plate includes an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface. Each of the coupling regions covers a different zone of a semiconductor package when the package is positioned in close proximity to the first main surface of the plate. Circuitry electrically connected to each of the coupling regions of the probe plate via a different channel is operable to: measure a parameter indicative of the degree of capacitive coupling between each coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding coupling region; provide a capacitance signal based on the parameter measured for each of the coupling regions of the probe plate; and select different ones of the capacitance signals for analysis.

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Singapore, Singapore

Chow York Lee