Company Filing History:
Years Active: 1999-2005
Title: Innovations of Chon Cheong Lei
Introduction
Chon Cheong Lei is a prominent inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 17 patents. His work focuses on enhancing the efficiency and reliability of electronic components.
Latest Patents
One of his latest patents is titled "Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules." This invention involves an integrated circuit (IC) chip module that includes at least one integrated circuit chip mounted upon a substrate, along with a plurality of passive components. The design features a polymer-based bib with openings to accommodate the integrated circuit chip, ensuring effective thermal paste retention.
Another notable patent is "Solder reflow type electrical apparatus packaging having integrated circuit and discrete components." This patent outlines a modular electrical apparatus that incorporates both integrated circuits and discrete components. The fabrication process includes a series of steps for each component, ensuring high-quality assembly through reflow or joining steps, followed by solder flux cleaning and testing.
Career Highlights
Chon Cheong Lei is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His extensive experience and expertise have positioned him as a key contributor to the company's advancements in technology.
Collaborations
Throughout his career, Chon has collaborated with notable colleagues, including Peter Alfred Gruber and Krishna Gandhi Sachdev. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Chon Cheong Lei's contributions to integrated circuit technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the future of electronic components and systems.