The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2000
Filed:
Oct. 21, 1997
Timothy W Donahue, Port Ewen, NY (US);
Ellyn M Ingalls, Danbury, CT (US);
Chon Cheong Lei, Poughkeepsie, NY (US);
Wai Mon Ma, Poughkeepsie, NY (US);
Horatio Quinones, Wappingers Falls, NY (US);
Charles L Reynolds, Jr, Red Hook, NY (US);
Peter J Brofman, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.