The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6708872 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 23, 2004

Filed:

Mar. 27, 2002
Applicant:
Inventors:

Peter Alfred Gruber, Mohegan Lake, NY (US);

Chon Cheong Lei, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract

There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.


Find Patent Forward Citations

Gruber, Peter. (2004). Method and apparatus for applying solder to an element on a substrate (U.S. Patent No. 6708872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6708872

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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