The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2005
Filed:
Jun. 07, 2004
Tim H. Lee, New Paltz, NY (US);
Chon C. Lei, Poughkeepsie, NY (US);
Donald J. Papae, Hopewell Junction, NY (US);
Francis F. Szenher, Fishkill, NY (US);
Tim H. Lee, New Paltz, NY (US);
Chon C. Lei, Poughkeepsie, NY (US);
Donald J. Papae, Hopewell Junction, NY (US);
Francis F. Szenher, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit (IC) chip module includes at least one integrated circuit chip mounted upon a substrate, and a plurality of passive components mounted upon the substrate. A polymer based bib has at least one opening formed therein, the at least one opening configured to accommodate the at least one integrated circuit chip therein, and the bib further configured for attachment to one or more of the plurality of passive components. A protective cap is mounted over the at least one integrated circuit chip and attached to the substrate, wherein the bib is configured to retain thereon a thermally conductive paste initially applied to at least one of the integrated circuit chip and the protective cap.