Tim H Lee

Title: Tim H Lee: Innovator in Integrated Circuit Technology

Introduction

Tim H Lee is a notable inventor based in New Paltz, NY (US). He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of thermal paste application in electronic devices.

Latest Patents

Tim H Lee holds a patent titled "Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules." This patent describes an integrated circuit (IC) chip module that includes at least one integrated circuit chip mounted upon a substrate, along with a plurality of passive components. The invention features a polymer-based bib with openings designed to accommodate the integrated circuit chip, ensuring effective attachment to the passive components. Additionally, a protective cap is mounted over the integrated circuit chip, which is attached to the substrate. The bib is specifically designed to retain a thermally conductive paste that is initially applied to the integrated circuit chip and the protective cap. This innovation is crucial for improving the thermal management of electronic devices.

Career Highlights

Tim H Lee is currently associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Chon Cheong Lei and Donald J Papae. Their collective expertise contributes to the advancement of technology within the company.

Conclusion

Tim H Lee's contributions to integrated circuit technology through his innovative patent demonstrate his commitment to enhancing electronic device performance. His work at IBM and collaborations with esteemed colleagues further solidify his position as a key figure in the field of technology.