Ching Yao Lin

Title: Ching Yao Lin: Innovator in Semiconductor Technology

Introduction

Ching Yao Lin is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work exemplifies the intersection of creativity and engineering in the rapidly evolving tech landscape.

Latest Patents

Ching Yao Lin holds a patent titled "Staggered metal mesh on backside of device die and method forming same." This patent describes a method that includes forming a first metal mesh over a carrier, followed by a first dielectric layer over the first metal mesh, and a second metal mesh over the first dielectric layer. The first and second metal meshes are staggered, enhancing the device's performance. The method further includes forming a second dielectric layer over the second metal mesh, attaching a device die over this layer, encapsulating the device die in an encapsulant, and forming redistribution lines that electrically connect to the device die. This innovative approach has the potential to improve the efficiency and reliability of semiconductor devices.

Career Highlights

Ching Yao Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His role at the company allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing processes.

Collaborations

Ching Yao Lin collaborates with talented professionals in his field, including Tzu-Sung Huang and Tsung-Hsien Chiang. These collaborations foster an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Ching Yao Lin's contributions to semiconductor technology through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an innovator in the industry. His achievements reflect the importance of collaboration and creativity in driving technological advancements.