Ching-Wei Hsu

Title: Innovations of Ching-Wei Hsu

Introduction

Ching-Wei Hsu is a notable inventor based in Changhua County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of through silicon via (TSV) structures and processes. With a total of 3 patents to his name, Hsu continues to push the boundaries of innovation in his field.

Latest Patents

Hsu's latest patents focus on the design and implementation of through silicon via structures. One of his patents describes a TSV structure located in a recess of a substrate, which includes a barrier layer, a buffer layer, and a conductive layer. The barrier layer covers the surface of the recess, while the buffer layer covers the barrier layer. The conductive layer fills the recess and is designed to have a smoother contact surface with the buffer layer compared to the contact surface between the buffer layer and the barrier layer. Additionally, a process for forming this TSV structure is also provided in his patent.

Career Highlights

Ching-Wei Hsu is currently employed at United Microelectronics Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of TSV structures, which are crucial for modern electronic devices.

Collaborations

Hsu collaborates with talented individuals in his field, including Jia-Jia Chen and Chi-Mao Hsu. Their combined efforts contribute to the innovative projects at United Microelectronics Corporation.

Conclusion

Ching-Wei Hsu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work on through silicon via structures is paving the way for future advancements in electronic device manufacturing.