Ching-Piao Lin

Title: Innovations of Ching-Piao Lin

Introduction

Ching-Piao Lin is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the manufacturing process of semiconductor devices.

Latest Patents

Ching-Piao Lin holds a patent for a "via-first dual damascene process." This invention pertains to a semiconductor substrate that includes a conductive structure and a dielectric layer. The dielectric layer features a via opening that exposes the conductive structure. The via opening is filled with a gap-filling polymer, forming a gap-filling polymer (GFP) layer on the dielectric layer. The GFP layer is then etched back to a predetermined depth, creating a recess that exposes portions of the sidewalls of the via opening. A surface treatment is applied to alter the surface properties of the sidewalls and the exposed surface of the GFP layer. This process prevents a subsequent deep UV photoresist from interacting with the sidewalls or the exposed surface of the GFP layer in either a chemical or physical manner. Ching-Piao Lin has 1 patent to his name.

Career Highlights

Ching-Piao Lin is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to further his research and development efforts in semiconductor technologies.

Collaborations

Ching-Piao Lin has collaborated with notable colleagues, including Hsiao-Pang Chou and Ming-Hsing Liu. These collaborations have contributed to advancements in their respective fields and have fostered a productive research environment.

Conclusion

Ching-Piao Lin's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the industry. His work continues to influence the development of efficient manufacturing processes in the semiconductor field.