Aurora, IL, United States of America

Ching-Ming Tsai


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Jhudong Township, TW (2016)
  • Aurora, IL (US) (2017)

Company Filing History:


Years Active: 2016-2017

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Ching-Ming Tsai: Innovator in Polishing Technology

Introduction

Ching-Ming Tsai is a notable inventor based in Aurora, IL (US). He has made significant contributions to the field of polishing technology, holding a total of 2 patents. His work focuses on developing innovative polishing pads that enhance the efficiency of substrate polishing processes.

Latest Patents

Tsai's latest patents include a "Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith." This invention provides a polishing pad designed for chemically-mechanically polishing a substrate. The polishing pad features a plurality of grooves, including at least a first plurality of concentric grooves with a first center of concentricity and a second plurality with a second center of concentricity. Notably, the first and second centers of concentricity do not coincide, and the axis of rotation of the polishing pad is not aligned with at least one of these centers. Additionally, the grooves do not form a continuous spiral pattern, and the polishing surface lacks a mosaic groove pattern.

Another significant patent is the "CMP polishing pad having edge exclusion region of offset concentric groove pattern." This invention also provides a polishing pad and method for chemically-mechanically polishing a substrate. The pad comprises a grooved region and an exclusion region, which is located adjacent to the circumference of the polishing pad and is devoid of grooves.

Career Highlights

Ching-Ming Tsai is currently employed at Cabot Microelectronics Corporation, where he continues to innovate in the field of polishing technology. His work has been instrumental in advancing the capabilities of polishing pads used in various applications.

Collaborations

Tsai has collaborated with several talented individuals, including Shi-Wei Cheng and Jia-Cheng Hsu. Their combined expertise has contributed to the development of cutting-edge polishing solutions.

Conclusion

Ching-Ming Tsai's contributions to polishing technology through his innovative patents have significantly impacted the industry. His work at Cabot Microelectronics Corporation exemplifies the importance of continuous innovation in enhancing substrate polishing processes.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…