Ching-Liang Weng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the area of impedance matching and high-frequency switches. With a total of seven patents to his name, Weng's work has had a substantial impact on multi-layer printed circuit board technology.

Latest Patents

One of Weng's latest patents is focused on high frequency and wide band impedance matching. This innovation is applicable to multi-layer printed circuit boards, which may include several signal transmission traces and ground layers. The design allows for signal transmission vias to connect between the signal transmission traces, while ground vias stabilize the characteristic impedance of the transmission traces. Another notable patent is for a high-frequency switch in a multi-layer substrate. This switch module consists of a build-up multi-layer structure that incorporates numerous conductive and dielectric layers. The integration of passive devices within this structure enhances its functionality and efficiency.

Career Highlights

Ching-Liang Weng is affiliated with the Industrial Technology Research Institute, where he continues to advance his research and development efforts. His work has been instrumental in pushing the boundaries of technology in his field.

Collaborations

Weng has collaborated with several notable colleagues, including Chang-Sheng Chen and Ying-Jiunn Lai. Their combined expertise has contributed to the success of various projects and innovations.

Conclusion

Ching-Liang Weng's contributions to the field of electrical engineering through his patents and collaborations highlight his role as a leading inventor. His work continues to influence advancements in technology, particularly in multi-layer printed circuit board applications.

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