The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Jun. 21, 2010
Uei-ming Jow, Hsinchu, TW;
Ching-liang Weng, Hsinchu, TW;
Ying-jiunn Lai, Hsinchu, TW;
Chang-sheng Chen, Hsinchu, TW;
Uei-Ming Jow, Hsinchu, TW;
Ching-Liang Weng, Hsinchu, TW;
Ying-Jiunn Lai, Hsinchu, TW;
Chang-Sheng Chen, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.