Taichung, Taiwan

Ching-Kun Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Ching-Kun Yeh: Innovator in Semiconductor Packaging

Introduction

Ching-Kun Yeh is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and structures. His work has led to advancements that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Ching-Kun Yeh holds a patent for the "Structure of disturbing plate having down set." This invention pertains to a disturbing plate structure that includes at least one down set, which is applicable in a lead frame-type package in a semiconductor. The design features a lead frame, a die, a glue layer, multiple disturbing plates, and both top and bottom mold compounds. The configuration allows for two disturbing plates to be positioned on either side of the die, creating a space through the bending of specific portions of the disturbing plate. This innovative approach ensures that the top and bottom mold compound sections maintain substantially equal volumes, facilitating effective packaging and forming.

Career Highlights

Ching-Kun Yeh is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop and refine semiconductor packaging technologies. His expertise in this area has positioned him as a key player in the industry, contributing to the advancement of semiconductor manufacturing processes.

Collaborations

Ching-Kun Yeh has collaborated with several talented individuals in his field, including coworkers Yueh-Chiung Chang and Ya-Yi Lai. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Ching-Kun Yeh's contributions to semiconductor packaging through his innovative patent and collaborative efforts highlight his importance in the field. His work continues to influence the industry, paving the way for future advancements in semiconductor technology.

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