Siliconware Precision Industries Co., Ltd.

Ching-Kun Yeh

Yueh-Chiung Chang

Ya-Yi Lai

Chih-Tsung Hou

Kun-Ming Huang

A disturbing plate structure having at least one down set, applicable in a lead frame-type package in a semiconductor. The disturbing plate has at least a lead frame, a die, a glue layer, a plurality of disturbing plates, a top mold compound, and a bottom mold compound. The lead frame has a plurality of leads. Two disturbing plates are located on two sides of the die. A space is formed by bending a first bent portion and a second bent portion of the disturbing plate down. Finally, the lead frame is encapsulated with a mold compound. By adjusting the size of the space formed by the first bent portion and the second bent portion, the top mold compound section has substantially the same volume as the bottom mold compound section to finish the packaging and forming.

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Taichung, Taiwan

Ching-Kun Yeh