Location History:
- Hsin-Tien Taipei Hsien, TW (1998)
- Hsin-Tien, Taipei Hsien, TW (2000)
- Kaohsiung, TW (2021 - 2024)
Company Filing History:
1 out of 1,874 
3 out of 832,880 Years Active: 1998-2024
Title: **Ching-Ho Chang: Innovator in Semiconductor Packaging**
Introduction
Ching-Ho Chang, based in Kaohsiung, Taiwan, is a notable inventor with a focus on semiconductor packaging technologies. With a total of four patents to his name, Chang has made significant contributions to the field, enhancing the efficiency and performance of semiconductor devices.
Latest Patents
One of Chang's latest patents is titled "Semiconductor package and method for manufacturing the same." This innovative semiconductor package incorporates a first die featuring a first surface, along with a first conductive bump positioned over this surface. This bump has defined height and width measurements, while a second conductive bump is integrated into the design as well, showing a different height and width. Notably, the width of the first bump is greater than that of the second, and the height of the first bump is nearly identical to the height of the second. This patent also details a comprehensive method for manufacturing the semiconductor package, reflecting Chang's commitment to advancing semiconductor technology.
Career Highlights
Throughout his career, Chang has been associated with prominent companies in the semiconductor industry, including Advanced Semiconductor Engineering, Inc. His work within this leading firm has allowed him to collaborate on cutting-edge technologies, pushing the boundaries of semiconductor applications.
Collaborations
Chang has collaborated with talented individuals such as An-Nong Wen and the accomplished female engineer Ching-Han Huang. These partnerships have played a crucial role in driving innovation forward and demonstrate Chang's ability to work within a team dynamic, leveraging diverse expertise to achieve significant advancements.
Conclusion
Ching-Ho Chang's impactful patents and collaborations signify his vital role in the evolution of semiconductor packaging. His inventive spirit and dedication to enhancing technology continue to shape the future of the industry, inspiring new generations of inventors to explore the vast potential of semiconductor innovations.